On today's episode we continue on with our technical sub-series about the assembly process. We delve into selective soldering, which is used to solder through hold components onto boards.
Show notes:
-We answer a question from a listener about tomb stoning, why it is no longer as prevalent in pcb assembly today, and how to prevent it
-https://www.worthingtonassembly.com/perfect-0201-footprint
-https://www.worthingtonassembly.com/perfect-0402-footprint
-Worthington uses selective soldering machines made by RPS Automation which is now ---Hentec Industries - https://rpsautomation.com/vector460/
-Need to see it to understand it. https://youtu.be/p-VImd2yW5s
-Stages of selective soldering - we use 1. preheat 2. flux 3. solder
-Advantages vs disadvantages of selective soldering
-Design tips to make it go more smoothly
In this episode we are joined by Mike Konrad to chat about board cleaning. In the first part of this conversation we delve into the history of board cleaning, the electronics the industry's transition to primarily using no-clean flux, and why more and more companies are reintroducing board cleaning back into their assembly process.
On this episode we are joined by Nicole Poirier who works in the receiving and shipping department at Worthington. She walks us through how we prepare the boards to leave our facility on their end journey to your doorstep.
We often get asked about the best way to route very fine pitch BGA and CSP packages. Often times designers think they need to route their traces between the BGA pads. But if you try that, then you will violate our 3-mil trace width and gap. So what’s to be done?
