In this episode, we dive into the crucial role of stencils in electronics manufacturing. Joined by Brett Babilonia, we explore the complexities of stencil design, including handling missing data, determining foil thickness, and ensuring optimal solder paste application. We discuss common issues, such as SMT standoffs and hybrid components. Stay tuned for for more of an in-depth continuation in Part Two.

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Listen to Part 2 of this episode here!

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